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RTG Presentation
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Packaging
RTG offers a wide array of package options for all applications. These include:
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| Package
Type |
Description |
Body size |
Pincount |
| BGA |
Ball Grid Array |
4-17 mm |
16-256 |
| CQFP |
Ceramic Quad Flat |
10-28 mm |
64-208 |
| DDPAK |
Thermal Power |
400 mil |
3-7 |
| LQFP |
Low Profile Quad Flat |
5-24 mm |
32-176 |
| MLP |
Micro Leadframe |
3-9 mm |
8-64 |
| MQFP |
Metric Quad Flat |
10-32 mm |
24-240 |
| PDIP |
Plastic Dual Inline |
300/600 mil |
8-48 |
| PLCC |
Plastic Leaded Chip Carrier |
9-30 mm |
20-84 |
| QFN |
Quad
Flat No-lead |
3-12 |
4-104 |
| QFP |
Quad Flat Pack |
10-400 mm |
44-304 |
| QSOP |
Quarter Small
Outline Package |
150/300 mil |
16-44 |
| SOIC |
Small Outline |
150/300 mil |
8-28 |
| SOT66 |
Small Outline |
1.66 mm |
8 |
| TQFP |
Thin Quad Flat Pack |
150/300 mil |
32-144 |
| TSSOP |
Thin Shrink SOP |
4-6 mm |
8-56 |
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