Many RTG designs start with Systems Engineering. RTG has extensive system expertise and has been contracted to assist systems engineers tailor key operating characteristics to target processes. RTG has also assisted in frequency planning to ensure that the system specification is most likely to yield in silicon.

RTG uses only the best tools for IC design.

RTG Front-loads the project with back-end issues and sets objectives for each design phase:
Design for the end application using detailed specifications and checklist of the key characteristics.
Design for test by identifying the means to measure performance.
Design for yield by identifying key process variables and reducing variability with design strategies.

Advance Design Phase:
Resolve important specification TBD’s.
Create Compliance Matrix.
Develop detailed block diagram.
Select appropriate process to start schematic capture.
Identify major risk issues (if any).
Demonstrate product feasibility.

Preliminary Design Phase Schematic Capture, Simulation:
Complete all schematic capture.
Fill in Compliance Matrix at typical conditions. (Centered Design.)
Perform selected simulation for best and worst case conditions. (Process & Environment)
Develop test strategy
Demonstrate low risk for layout.

Critical Design Phase:
Complete simulations over variations in process and temperature.
Demonstrate design meets specification with margin
Complete layout, back-annotate and re-simulate
Complete top-level layout, DRC (Design Rule Checking) and LVS (Layout Vs. Schematic).
Close any Preliminary Design Action Items.
Demonstrate worthiness for fab & test.

Occasionally we test critical circuits with MultiProject Wafer (MPW) runs

All design effort includes early selection of the right process.